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Press Release

Adesto Technologies Partners With SemiDice to Distribute Bare Die

Wednesday, August 19, 2015.

New Sales Channel Expands Availability of Non-Volatile Memory for Known Good Die Applications

SUNNYVALE, CA–(Marketwired) – Adesto Technologies, the inventor of the world’s lowest power memory solutions, today announced a distribution agreement with SemiDice, Inc., a value-add die distributor dedicated to enhancing the process of selling bare die and wafers into high reliability applications.

Components in die or wafer form can offer electronics designers significant advantages. Bare die are essential to stacked chip and other multi-chip packages, increasingly important solutions with the emergence of Internet of Things applications and overall trends toward smaller devices, lower manufacturing costs, higher performance and longer battery life. Adesto’s non-volatile memory die can help designers overcome the costs and challenges of embedded flash scalability, as well as memory density and performance limitations. Adesto’s memory solutions also address concerns related to embedded SRAM and Flash power consumption as process nodes continue to shrink.

“SemiDice offers unique capabilities in distribution with their special ability to handle and process die in wafer form,” said Jim Monteverde, Director of Global Distribution at Adesto. “Their expertise with wafers and ability to dice and sample our memory products to customers provides a great benefit and a new channel to support applications in markets ranging from wearable electronics to medical, industrial, military and aerospace.”

“We’re excited to add Adesto’s low-power, low-energy memory to our portfolio of products,” said Scott Smith, Director of Business Development at SemiDice. “Adesto’s reputation for quality products will contribute to our focus to provide customers with high-reliability products and services.”

“Value-added services and flexibility set SemiDice apart from other distributors,” said Paul Hill, Adesto’s Director of Product Marketing. “They support customers’ every need for bare die — from documentation and die maps to specialized testing and handling.”

A large range of Adesto’s low-power, non-volatile serial memory solutions are available as individual bare die or as full wafers though SemiDice. Visit www.adestotech.com for more information.

About Adesto Technologies Corporation
Adesto is the inventor of the world’s lowest power memory solutions unleashing innovation for a new class of connected applications and previously unimagined devices. The company has designed and built a portfolio of innovative products, including Fusion Serial Flash, DataFlash® and Conductive Bridging RAM (CBRAM®). CBRAM® is a breakthrough technology platform that enables 100 times less energy consumption than today’s memory technologies without sacrificing speed and performance. Founded in 2007 in Sunnyvale, CA, Adesto holds more than 100 patents with dozens more in process and is working with visionary companies across various industries to deploy its technology to the market.

About SemiDice, Inc.
SemiDice is the preferred global wafer and bare die component supplier to the microelectronic industry. SemiDice is the only global wafer processor with a High Reliability Division dedicated to providing bare die for military, aerospace, medical and robust industrial applications. With its headquarters in Los Alamitos, CA and sales offices in the US, United Kingdom and China, SemiDice is well-positioned to support customer requirements worldwide. Visit www.semidice.com for more information.

Press Contact

David Viera

Director of Corporate Communications

Adesto Technologies

Sunnyvale, USA

e:[email protected]