Package Materials Information

Package Materials Datasheets

As part of Adesto’s Pb-free and green program, the following Package Material Declaration Datasheets (PMDD) have been created to list all the substances found in Adesto packaged devices. This information can be used by customers to determine compliance to the various environmental legislation that exists worldwide. Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information. Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. Please contact your Adesto sales representative for assistance if the PMDD you require is not present on this website. Click on the appropriate link below to view available package material declaration datasheets.

Category Package Lead Finish Name Description
Leadframe Package SOIC – EIAJ Matte Tin EIAJ-8-STN 8-Lead, 0.208″ Body, Plastic Small Outline Package (EIAJ)
Leadframe Package SOIC – EIAJ Ni-Pd-Au EIAJ-8-STN-NPG 8-Lead, 0.208″ Body, Plastic Small Outline Package (EIAJ)
Leadframe Package SOIC – JEDEC Matte Tin SOIC-8-SWB 8-Lead (0.150″ Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
Leadframe Package SOIC – JEDEC Ni-Pd-Au SOIC-8-SWB-NPG 8-Lead (0.150″ Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
Leadframe Package UDFN Ni-Pd-Au UDFN-8-YFG-NPG 8-Pad, 5 x 6 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
Leadframe Package UDFN Ni-Pd-Au UDFN-8-YCQ-NPG 8-Pad, 2 x 3 x 0.6 mm Body, 0.5 mm Pitch, 1.6 x 0.2 mm Exposed Pad, Plastic Ultra Thin Dual Flat No Lead Package (UDFN/USON)
Leadframe Package VDFN Matte Tin VDFN-8-YTK 8-Pad, 8 x 6 x 1.0 mm Body, Very Thin Dual Flat No Lead Package (VDFN)
Leadframe Package VDFN Ni-Pd-Au VDFN-8-YKL-NPG 8-Pad, 6 x 8 x 1.0 mm Body, Thermally Enhanced Plastic Very Thin Dual Flat No Lead Package (VDFN)
Other Package CASON Other CASON-8-DYV 8-Pad, 8 x 6 x 1.0 mm Body, Very Thin Dual Flat No Lead Package (VDFN)
BGA Package UBGA Sn-Ag-Cu UBGA-9-CAA 8-Pad, 6 x 8 x 1.0 mm Body, Thermally Enhanced Plastic Very Thin Dual Flat No Lead Package (VDFN)
Leadframe Package TSOP Matte Tin TSOP-28-TBB 8-Pad, 8 x 6 x 1.0 mm Body, Very Thin Dual Flat No Lead Package (VDFN)
Leadframe Package TSSOP Ni-Pd-Au TSSOP-8X 8-Lead, 4 x 3 x 1.2 mm Body, Thin Shrink Small Outline Package (TSSOP)
BGA Package WLCSP Sn-Ag-Cu WLCSP-8-GHB 8-Ball, 2.860 x 1.500 x 0.409 mm Body, 4 x 2 Array, 0.50 mm Pitch, WLCSP (637N6)