Memory Support

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Support Request

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FAQ

Q: How do you configure Dataflash Binary and Standard Page Sizes?

A: The DataFlash ships with a DEFAULT page size of 264 or 528 Bytes. To configure the Dataflash in the Binary mode (256 / 512 Byte pages) please refer to the following steps at power up:
1. Power up.
2. Read the Status Register byte 1, bit 0.
3. If this bit is 1 then all is good so start running.
4. If this bit is 0 then the device is configured for 264 byte page size.
5. Send the command 0x3D, 0x2A, 0x80, 0xA6 to change it to a ‘Binary’ page size.
6. Start running . This should only need to be done once at first power up. and allows you to fit 2B and non 2B parts with no changes.


Q: I need to replace the AT45DB011D in my design. What is the difference between this part and the AT45DB021E?

A: You can download a comparison here.

Download the AT45DB011D vs AT45DB021E


Q: Where can I find Simulation Tools for Adesto products?

A: Visit our Simulation Tools page.


Q: Where can I find Source Code Examples for Adesto products?

A: Download our application note here.

Download the Source Code Examples application note


Q: Where can I find Programmer Support for Adesto products?

A: Download our 3rd Party Programmer Support document.

Download the Programmer Support


Q: What do the part number suffixes SL954 (and SL955) stand for?

A: This indicates the product is binary page size. Please refer to the product datasheet for specifics regarding the binary page size.


Q: I need to replace the AT25DF041A in my design. What is the difference between this part and the AT25SF041?

A: You can download a comparison here.

Download the AT25DF041A vs AT25SF041


Q: What does the part number suffix SL383 stand for?

A: This indicates the product is shipped in Tape and Reel.


Q: Where can I get pad layout suggestions for the SS (.150 SOIC) and M (UDFN) package types?

A: You can download a PDF with layout suggestions here.

Download the SSH and MH Pad Layout Suggestions


Q: I need to transition from the AT45DB641D-CNU to the AT45DB641E – with the S or MW package. Where can I get pad layout suggestions for the S (.208 SOIC) and MW [MLF (VDFN)] package types?

A: You can download a PDF with layout suggestions here.

Download the AT45DB641E-SHN, AT45DB641E-MWHN


Q: I need more technical information on the transition ( migration ) from DataFlash “D” series to “E” series parts. Where can I get this?

A: Download the guides.

Download the 021D to 021E
Download the 041D to 041E
Download the 081D to 081E
Download the 161D to 161E
Download the 321D to 321E
Download the 642D to 641E


Q: I need to replace the AT25DF641 in my design. What is the difference between this part and the AT25DF641A?

A: You can download a comparison here.

Download the AT25641A Comparison


Q: I need to replace the AT25F512B in my design. What is the difference between this part and the AT25DN512C?

A: You can download a comparison here.

Download the AT25DN512C Comparsion


Q: I need to replace the AT25DF041A in my design. What is the difference between this part and the AT25DF081A and AT26DF081A?

A: You can download a comparison here.

Download the AT25DF081A Comparison


Q: What is Adesto’s recommended reflow soldering temperature profile for Serial Flash products?

A: We follow JEDEC’s Standard. You can download it here. See Table 5-2 and Figure 5-1 (pages 7 and 8).

Download the JEDEC Moisture/Reflow


Q: How do I convert the 24Ball BGA package to the 9Ball BGA Package Footprint?

A: You can download a description here.

Download the 24 to 9 BGA


Q: What is the difference between Byte Programming, Page Programming and Sequential Programming? How is Sequential Programming different from Page Programming?

A: There are three ways to program the serial flash device: 1) Byte by byte, 2) Page program, and 3) Sequential program.

Byte programming requires the Command Code, plus three address bytes and then the data byte. When Chip select goes high the byte is programmed to the memory. To program the next byte this sequence is repeated. Command, 3 x Addr, 1 x Data.

Page Programing is similar to Byte programming but instead of de-selecting chip select signal when the first data byte is loaded and then waiting for the device to program that data, you can keep CS low and continue to clock in up to 256 bytes into the buffer. Then, when CS goes high, all 256 Bytes will be programmed to sequential address locations from the address location specified at the start of the command. This can only be a maximum of 256 Bytes (which is the size of the on-chip sram buffer). Command, 3 x Addr, 1 x Data, 1 x Data, 1 x Data ~~~~~~ 1 x Data.

The Sequential program mode is the same as Byte program but uses an internal address counter to keep track of the last address used. This means that the user only needs to load the address of the first data bytes, and once that is programmed they can send the ADh or AFh command and the next data byte (without needing to send the 3 address bytes again). Although the device still has to wait whilst each data byte is programmed, the fact that you do not need to keep sending address information makes the whole process a little quicker. Command, 3 x Address, 1 x Data (Wait for program cycle), Command, 1 x Data (Wait), Command, 1 x Data (Wait), etc.

In all cases, the address location that is to be programmed, whether by Byte programming, page programming or sequential programming MUST be erased first. On the Adesto Fusion memories, you can use page erase (256byte pages) or 4Kbyte, 32Kbyte and 64Kbyte BLOCK erase.

In terms of user software, sequential programming is easier to implement, but page programming will still be slightly faster. Byte programming is good for situations where one or two bytes need to be programmed to a random location.


Q: What are the parameters CPHA and CPOL for Adesto Serial Flash and Dataflash devices?

A: CPOL and CPHA define the clock modes. CPOL indicates the idle level for SCK (0 for idle low, 1 for idle high). CPHA indicates the clock phase. Adesto devices operate in mode-0 (CPOL=0, CPHA=0) and in mode-3 (CPOL=1, CPHA=1).


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Product Change Notifications

Click on a document link below to download:

Control Number Title Type Date Issued
PCN041 DataFlash AT45DB321E and AT45DQ321 Yield Improvement Change May 23, 2019
PCN040 Yield Improvement; 1 layer mask change AT45DB161E and AT45DQ161 products Change April 30, 2019
PCN039 Wafer Probe Test Equipment Transfer Change January 28, 2019
PCN038 Wafer Probe Facility Addition Teraprobe Change January 28, 2019
PCN037 WLCSP Assembly Location Addition PTI Change January 28, 2019
PCN036 AT25DF641A & AT45DB641E Change October 14, 2018
PCN035 BGA package of serial flash EOL March 28, 2018
PCN034 Addendum PCN034 Addendum Change May 15, 2018
PCN034 Capacity Expansion for the .150″ Narrow SOIC Product Package Change March 8, 2018
PDF033 64-Mbit Standard Serial Flash® (AT25QF641) – Product Improvement Changes Change November 28, 2017
PDF032 Manufacturing Capacity Expansion for the 8-contact, 6 x 8mm VDFN Package Change August 1, 2017
PDF031 AT25DL081-UUN-T and AT25DL161-UUN-T End of Life EOL May 30, 2017
PDF030 Addition of UMC 8S Wafer Fabrication Facility for All AT25DF321A Products Change June 29, 2017
PDF029 8-Mbit DataFlash® (AT45DB081E) – Yield Improvement Change May. 5 2017
PDF028 4-Mbit DataFlash® (AT45DB041E) – Yield Improvement Change Feb. 15 2017
PDF027 2-Mbit DataFlash® (AT45DB021E) – Yield Improvement Change May 2 2016
PDF-SF026 Capacity Expansion for the .208” Wide SOIC Product Package Change Apr. 6 2016
PDF023 1Mbit Serial Flash AT45DB011D End of Life EOL Feb 10 2015
PDF-SF022 Capacity Expansion for the UDFN Product Package Change Jan 16 2015
PDF021 64-Mbit DataFlash® (AT45DB641E) Wafer Manufacturing Plant Addition Change Oct 30 2014
PDF020 Limited PCN (Customer Specific) – AT45DB011D-xxHGK EOL for parts with CAN Code HGK EOL Mar 5 2014
PSF017 32Mbit Serial Flash AT25DQ321 End of Life EOL Jan 16 2014
PSF016-A 4-Mbit Serial Flash – Alternate Part Number Correction to PSF016 EOL Apr 17 2014
PSF016 4Mbit Serial Flash AT25DF041A End of Life EOL Jan 16 2014
PSF014-B 512kbit Serial Flash – Revised Replacement Part Number and MSL Rating EOL Jul 08 2014
PSF014-A 512kbit Serial Flash – Part Number Addition to PSF014 EOL Mar 11 2014
PSF014 512kbit Serial Flash (AT25F512B and AT25BCM512B) URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) EOL Jan 16 2014
PDF013-A 32-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) EOL Jan 16 2014
PDF013 32-Mbit DataFlash® (AT45DB321D) Process Geometry Shrink and Device Enhancement (Replaced by PDF013-A) EOL Ext. Oct. 31 2013
PDF012-A 8-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) EOL Jan 16 2014
PDF012 8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement (Replaced by PDF012-A) EOL Ext. Oct. 31 2013
PDF011-A 4-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) EOL Jan 16 2014
PDF011 4-Mbit DataFlash® (AT45DB041D) Process Geometry Shrink and Device Enhancement (Replaced by PDF011-A) EOL Ext. Oct. 31 2013
PDF010-A 64-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) EOL Jan 16 2014
PDF010 64-Mbit DataFlash® (AT45DB642D) Process Geometry Shrink and Device Enhancement (Replaced by PDF010-A) EOL Oct. 24 2013
PDF009 8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement EOL Sep. 10 2013
PDF008 32-Mbit DataFlash® (AT45DB321D) Process Geometry Shrink and Device Enhancement EOL Aug. 21, 2013
PDF007 4-Mbit DataFlash® (AT45DB041D) Process Geometry Shrink and Device Enhancement EOL Aug. 21 2013
PDF006 16-Mbit DataFlash® (AT45DB161E) Wafer Manufacturing Plant Addition PCN Jun. 20 2013
PDF-SF005 Adesto® Products – Wafer Probe Test Site PCN Jan. 29 2013
PDF-SF004 Adesto® Serial Flash & DataFlash® Products Package Marking Change PCN Dec. 26 2012
PDF-SF003 Special Lot Flow SL551 Discontinuance EOL Sep. 30 2013
PDF002 2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement – REVISED EOL Ext. Dec. 7 2012
PDF001 16-Mbit DataFlash® (AT45DB161D) Process Geometry Shrink and Device Enhancement – REVISED EOL Ext. Dec. 7 2012
AD011014 Critical Update Regarding Adesto Technologies Products Manufactured at LFoundry-Rousset Letter Jan. 10 2014
SC120701 8-Mbit Serial Flash (AT25DF081, 1.65V to 1.95V) Process Geometry Shrink EOL Mar. 6, 2012
SC124101 Atmel Sale of Serial Flash Product Family to Adesto PCN Oct. 12, 2012
GUIDE Adesto DataFlash ‘D’ to ‘E’ Series Conversion Chart GUIDE Jan 21 2014


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Failure Analysis Request

This form allows users to submit a Failure Analysis Request. This does not ensure that the request will be approved. By completing this form, an FA number will be generated for tracking purposes. Please provide up to four suspect units and one known good unit (the maximum number of units typically accepted for failure analysis is 10). After submission you will receive an email confirming receipt of the Failure Analysis request. Once a product quality contact has been assigned you will receive another email with the PQA #, ship to address, and Product Quality contact information.

Fill in the fields below.
The items marked by an asterisk (*) are mandatory fields and must be completed before submitting the form.


Product Information

Other Contact Info

Comments for failure analysis (please provide detailed explanation)


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Product Sample Request

Adesto provides samples of our memory devices to approved parties upon request. Note about the ordering part number: the last two characters in an Adesto memory part number is either a “-Y”, “-T” or “-B”. When ordering samples of a memory product, always specify the “-T” suffix and not the “-B” or “-Y” suffix.

Order Samples

For wafer/KGD product samples, please contact info@adestotech.com.


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RMA Request

This form allows users to submit a Returned Material (RMA) request. This does not ensure that the RMA request will be approved. By completing this form, an RMA number will be generated for tracking purposes. The items marked by an asterisk are mandatory fields and must be completed before submitting the form.

Fill in the fields below.
The items marked by an asterisk (*) are mandatory fields and must be completed before submitting the form.


Product Information

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Reason for Return (please provide detailed explanation)


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Adesto Product Programmer Support

Device programmer equipment manufacturers that support Adesto Memory products.


Programmer Equipment Manufacturer Website
Advantech http://www.aec.com.tw
Algocraft SRL http://www.algocraft.com/en/
BP Microsystems http://www.bpmmicro.com/
Data IO http://www.dataio.com/
Dataman http://www.dataman.com/
Dediprog http://www.dediprog.com/
EE Tools http://www.eetools.com
Elnec http://www.elnec.com
Equinox Technologies http://www.equinox-tech.com
HiLo http://www.hilosystems.com.tw
LEAP http://www.leap.com.tw
Minato http://www.minato.co.jp
Novaflash https://www.nova-flash.com/
Phyton Inc. http://www.phyton.com
Reveltronics https://www.reveltronics.com/en/
Segger Micro http://www.segger.com
SMH Technologies http://www.smh-tech.com
System General http://www.sg.com.tw
Total Phase http://www.totalphase.com
Xeltek https://www.xeltek.com
ZLG Electronics Co., Limited http://www.zlgmcu.com


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