Package Materials Information

Package Materials Datasheets

As part of Adesto’s Pb-free and green program, the following Package Material Declaration Datasheets (PMDD) have been created to list all the substances found in Adesto packaged devices. This information can be used by customers to determine compliance to the various environmental legislation that exists worldwide. Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information. Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. Please contact your Adesto sales representative for assistance if the PMDD you require is not present on this website. Click on the appropriate link below to view available package material declaration datasheets.

CategoryPackageLead FinishNameDescription
Leadframe PackageSOIC – EIAJMatte TinEIAJ-8-STN8-Lead, 0.208″ Body, Plastic Small Outline Package (EIAJ)
Leadframe PackageSOIC – EIAJNi-Pd-AuEIAJ-8-STN-NPG8-Lead, 0.208″ Body, Plastic Small Outline Package (EIAJ)
Leadframe PackageSOIC – JEDECMatte TinSOIC-8-SWB8-Lead (0.150″ Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
Leadframe PackageSOIC – JEDECNi-Pd-AuSOIC-8-SWB-NPG8-Lead (0.150″ Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
Leadframe PackageUDFNNi-Pd-AuUDFN-8-YFG-NPG8-Pad, 5 x 6 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
Leadframe PackageUDFNNi-Pd-AuUDFN-8-YCQ-NPG8-Pad, 2 x 3 x 0.6 mm Body, 0.5 mm Pitch, 1.6 x 0.2 mm Exposed Pad, Plastic Ultra Thin Dual Flat No Lead Package (UDFN/USON)
Leadframe PackageVDFNMatte TinVDFN-8-YTK8-Pad, 8 x 6 x 1.0 mm Body, Very Thin Dual Flat No Lead Package (VDFN)
Leadframe PackageVDFNNi-Pd-AuVDFN-8-YKL-NPG8-Pad, 6 x 8 x 1.0 mm Body, Thermally Enhanced Plastic Very Thin Dual Flat No Lead Package (VDFN)
Other PackageCASONOtherCASON-8-DYV8-Pad, 8 x 6 x 1.0 mm Body, Very Thin Dual Flat No Lead Package (VDFN)
BGA PackageUBGASn-Ag-CuUBGA-9-CAA8-Pad, 6 x 8 x 1.0 mm Body, Thermally Enhanced Plastic Very Thin Dual Flat No Lead Package (VDFN)
Leadframe PackageTSOPMatte TinTSOP-28-TBB8-Pad, 8 x 6 x 1.0 mm Body, Very Thin Dual Flat No Lead Package (VDFN)
Leadframe PackageTSSOPNi-Pd-AuTSSOP-8X8-Lead, 4 x 3 x 1.2 mm Body, Thin Shrink Small Outline Package (TSSOP)
BGA PackageWLCSPSn-Ag-CuWLCSP-8-GHB8-Ball, 2.860 x 1.500 x 0.409 mm Body, 4 x 2 Array, 0.50 mm Pitch, WLCSP (637N6)